October 7, 2026
Sumitomo Electric Lightwave and Sumitomo Electric Group will exhibit and present at the 2026 OCP Global Summit, October 12–15, 2026, in San Jose, California. Our exhibit will span every layer of the data center, from below the chip to the connections between facilities, with solutions we develop hand in hand with our customers and deliver reliably, at scale.
Dwayne Holst, Sumitomo Electric Lightwave’s AI Data Center Automation Software Architect, will be a featured Expo Hall session speaker on Thursday, October 15, at 10:40 a.m. in the Expo Hall Theater, SJCC, Concourse Level. His session, multi-core fiber — a solution for scale up, out, and across, will explore the latest MCF innovations designed to address rack congestion in scale up/scale out segments of data centers.
In booth C9, we will showcase our recent achievements that advance multi-core fiber (MCF) for significantly more capacity and interconnections within existing networks, helping operators link racks, rows, and facilities into a single, unified compute resource pool.
These achievements are part of the recently completed SDM4 Multicore Fiber Multi-Source Agreement (SDM4 MCF MSA), whose members published Version 1.0 Technical Specifications defining requirements for a four-core multicore fiber intended for AI data centers, campus networks, and other short-reach optical links.
Other exhibit highlights will include:
Co-Packaged Optics
Inside the package sits the engine of AI. Integrating Sumitomo Electric Industries’ expertise in photonics, lasers, and optical connectivity, our co-packaged optics (CPO) solutions reduce the distance between components, increasing bandwidth, improving system performance, and enabling future scalability.
Come to booth C9 to see an intact co-packaged internal wiring concept model and a fully integrated co-packaged model to the ASIC installed in a rack. Ask us about co-packaged copper (CPC) flexible flat ribbon and flexible printed circuits. Below the chip, we bond gallium nitride (GaN) layers to diamond substrates for high productivity and heat dissipation.
AI-Optimized Rack
Scaling up looks different in a rack that has been optimized for AI workloads from top to bottom. Explore our AI-optimized rack in booth C9 and ask us about vertical separation in your raceways, U-turn bends for drop cables, spring-loaded dust covers, and our time-saving installation tool. New for 2026 OCP Global Summit, our exhibit will feature the 2OU panel with improved cable management and built-in sliders.
PON for Out-of-Band Management
Our XGS-PON optical line terminal (OLT) and optical network unit (ONU) system, paired with our custom-made fiber systems, brings passive optical networking (PON) technology to intra-facility out-of-band management, reducing power consumption and rack space compared to active networks. The 1RU OLT provides 64 PON ports, high-density fiber cabling runs through the distribution area, and cassettes in the rack deliver LC duplex outputs. The system also supports network-wide monitoring and flow management.
A passive optical distribution network and a redundant architecture with dual OLTs and ONUs support high reliability. With no active components in the distribution area and low-power OLTs and ONUs, power consumption stays low. And a minimal installation footprint, combined with high-density cabling, saves space.
42-Inch Fiber Cabinet
Designed for hyperscale end-of-row cable and fiber “entrance” applications, our 42-inch cabinet Supports a total of 3,008 MMC ports in a single unit. This floor-standing industrial cabinet features front, rear, and side doors, internal cable management fingers, center cable lancer plates, caster/leveler adjusters, and top/bottom baffles for airflow.
AI-Ready Connectors
The latest in high-density connector evolution includes our PrecisionFlex™ MT & TMT multi-row ferrules, the award-winning 32-fiber MMC, and the multi-source Prizm® TMT expanded beam ferrules. Stop by for our Prizm® TMT dust demonstration, and see the 3M Expanded Beam Optical (EBO) technology, a fiber-optic interconnect solution designed to simplify connectivity.
Award-Winning 16-Fiber Fusion Splicer
Our AI-enabled Quantum-Ultra Ribbon 16-fiber splicer, which earned a near-perfect 4.5/5.0 in the Lightwave Innovation Reviews, speeds the deployment of high-performance, next-generation hyperscale networks and is ready to support any network, no matter the fiber count or pitch requirements.
Together, these products enable rapid, reliable scaling up of high-density racks, scaling out across rows within data centers, and scaling across multi-location facilities. With operations in more than 40 countries, Sumitomo Electric is where you are. Building on a long history of industry, customer, and competitor collaboration, we design and deliver what's next. Our customer-derived solutions are built to perform at scale, always, and are Unique to You.
Join Sumitomo Electric, your single-source supplier, in booth C9 at the OCP Global Summit and contact us anytime. To stay up to date on our Next Generation Thinking™, follow along online and connect with us on LinkedIn or X.
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